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Service

Conference

  • 2021/, TPC member, Data Converter Sub-committee, IEEE Custom Integrated Circuits Conference (CICC), Austin/
  • 2018/2019/2020/2021/, TPC member, Data Converter Sub-committee, European Solid-State Circuits Conference (ESSCIRC), Dresden/Kraków/Grenoble/Grenoble/
  • 2015-2020, Student Research Preview Committee member, International Solid-State Circuits Conference (ISSCC), San Francisco, CA
  • 2019/2020/, TPC member, Data Converter Sub-committee, IEEE Asian Solid-State Circuits Conference (ASSCC), Macau/Hiroshima/
  • 2019/2020/, General Co-Chair, The 1st/2nd Workshop on IC Advances in China (ICAC), Chengdu/Shanghai/
  • 2018, TPC Chair, IEEE Asian-Pacific Conference on Circuits and Systems (APCCAS), Chengdu
  • 2017/2018, China Outreach Committee member, Design Automation Conference (DAC), Austin/San Francisco
  • 2021, Special Session Co-Chair, IEEE International Symposium on Circuits and Systems (ISCAS), Daegu, Korea
  • 2020, TPC member, International Symposium on Integrated Circuits and Systems (ISICAS), Shanghai (Paris)
  • 2019, Invited Session Co-Chair, IEEE International Symposium on Circuits and Systems (ISCAS), Sapporo, Japan
  • 2019, Publicity Co-Chair, IEEE International Conference on Electronics Circuits and Systems (ICECS), Genova, Italy
  • 2018, General Chair, IEEE Asia-Pacific Conference on Postgraduate Research in Microelectronics and Electronics (PrimeAsia), Chengdu
  • 2018/2019/2020, Sub-committee Co-Chair, The 1st IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA), Beijing/Chengdu/Nanjing
  • 2017, Publicity Co-Chair, The 1st New Generation of Circuits and Systems Conference (NGCAS), Genova, Italy
  • 2017, General Chair, The 1st UK-China Emerging Technologies (UCET) workshop, Chengdu
  • 2016/2018, TPC member, IEEE MTT-S International Wireless Symposium (IWS), Shanghai/Chengdu
  • 2016, General Co-Chair, The 1st IEEE International Conference on Integrated Circuits and Microsystems (ICICM), Chengdu
  • 2015/2017, TPC member, International Conference on ASIC (ASICON), Chengdu/Guiyang
  • 2014, TPC member, International Conference on Integrated Circuits (ISIC), Singapore

Journal

  • 2019-, Associate Editor, IEEE Open Journal of Circuits and Systems (OJCAS)
  • 2019-, Guest Editor, IEEE Transactions on Circuits and Systems -I: Regular Papers (TCASI)
  • 2012-2013, Guest Editor, Journal of Electronic Science and Technology (JEST)
  • 2010-2014, Editorial board member, International Journal of RF and Microwave Computer-Aided Engineering (RFMiCAE)

Tutorial and Lectureship

  • 2020-2021, Distinguished Lecturer, IEEE Solid-State Circuits Society (SSCS)
  • 2020.05.17, "Low-Power ADCs with Time-Domain Techniques," Half-day Tutorial at ISCAS 2020, Seville, Spain.

Administrative

  • 2014-2018, Vice Dean (International and Outreach), School of Microelectronics and Solid-State Electronics, UESTC
  • 2020-, Member, Academic Council of UESTC
  • 2016-, Member, International Education and Collaboration Committee, UESTC

Other Academic and Societal Service

  • 2018-, Analog Signal Processing Technical Committee (ASPTC) member, IEEE Circuits and Systems (CAS) Society
  • 2014-, Founding Chair, IEEE Chengdu SSCS/CASS Joint Chapter
  • 2010-2014, Single-Chip and Embedded Systems Committee member, Sichuan Institute of Electronics